TLP241A,TLP241AF

13

21.

21.

21.

21. Ordering Information (Example of Item Name)

Ordering Information (Example of Item Name)

Ordering Information (Example of Item Name)

Ordering Information (Example of Item Name)

Item Name

TLP241A(F

TLP241A(LF1,F

TLP241A(LF5,F

TLP241A(TP1,F

TLP241A(TP5,F

TLP241A(D4,F

TLP241A(D4,LF1,F

TLP241A(D4,LF5,F

TLP241A(D4,TP1,F

TLP241A(D4,TP5,F

TLP241AF(F

TLP241AF(LF4,F

TLP241AF(TP4,F

TLP241AF(D4,F

TLP241AF(D4LF4,F

TLP241AF(D4TP4,F

Packaging (Note 1)

TH

LF1

LF5

LF1

LF5

TH

LF1

LF5

LF1

LF5

TH, Wide forming

LF4, Wide forming

LF4, Wide forming

TH, Wide forming

LF4, Wide forming

LF4, Wide forming

VDE Option

EN 60747-5-5

EN 60747-5-5

EN 60747-5-5

EN 60747-5-5

EN 60747-5-5

EN 60747-5-5

EN 60747-5-5

EN 60747-5-5

Packing (MOQ)

Magazine (100 pcs)

Magazine (100 pcs)

Magazine (100 pcs)

Tape and reel (1500 pcs)

Tape and reel (1500 pcs)

Magazine (100 pcs)

Magazine (100 pcs)

Magazine (100 pcs)

Tape and reel (1500 pcs)

Tape and reel (1500 pcs)

Magazine (100 pcs)

Magazine (100 pcs)

Tape and reel (1000 pcs)

Magazine (100 pcs)

Magazine (100 pcs)

Tape and reel (1000 pcs)

Note 1: TH: Through-hole, LF: Lead forming for surface mount

22.

22.

22.

22. Devices in Halogen-Free Resin Packages

Devices in Halogen-Free Resin Packages

Devices in Halogen-Free Resin Packages

Devices in Halogen-Free Resin Packages

This product is Halogen-Free

Toshiba Electronic Devices & Storage Corporation ("Toshiba") defines a "Halogen-Free resin semiconductor

product" as a semiconductor product in which:

(1) the encapsulating resins do not contain any of the following elements: bromine (Br), chlorine (Cl) and antimony

(Sb), respectively, in an amount exceeding 0.09 weight percent, and do not contain chlorine and bromine in an

aggregate amount exceeding 0.15 weight percent of the encapsulating resins, and/or

(2) the resin portion(s) in printed circuit boards do not contain any of the following elements: bromine,

chlorine and antimony, respectively, in an amount exceeding 0.09 weight percent, and do not contain

chlorine and bromine in an aggregate amount exceeding 0.15 weight percent of the each resin portion(s) in

printed circuit boards.

For avoidance of doubt, "Halogen-Free resin semiconductor product" does not mean, and Toshiba does not make

any warranty of any kind, that said semiconductor product is entirely free of antimony or of any of the following

elements of the halogen family: bromine, chlorine, iodine (I), fluorine (F) and astatine (At).

In addition, a Halogen-Free resin semiconductor product may contain antimony and/or any of the elements of

the halogen family as mentioned in the above paragraph in one or more portion(s) of the semiconductor product

other than the encapsulating resins and the resin portion(s) in printed circuit boards.

The information provided herein is accurate as of the date that it was provided, to the best of the knowledge and

belief of the Toshiba Electronic Devices & Storage Corporation ("Toshiba"), Toshiba bases such knowledge and

belief on information provided by third parties, and Toshiba makes no representation or warranty as to the

accuracy of such third party information. Toshiba has taken and will continue to take, reasonable steps to provide

accurate information to its customers, but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals.

2020-02-17

Rev.7.0

©2016-2020

Toshiba Electronic Devices & Storage Corporation