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LP6261AB6F датащи(PDF) 3 Page - Lowpower Semiconductor inc

номер детали LP6261AB6F
подробное описание детали  Ultra low IQ Synchronous Boost Convertor
PDF  7 Pages
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производитель  POWER [Lowpower Semiconductor inc]
домашняя страница  http://www.lowpowersemi.com
Logo POWER - Lowpower Semiconductor inc

LP6261AB6F датащи(HTML) 3 Page - Lowpower Semiconductor inc

  LP6261AB6F Datasheet HTML 1Page - Lowpower Semiconductor inc LP6261AB6F Datasheet HTML 2Page - Lowpower Semiconductor inc LP6261AB6F Datasheet HTML 3Page - Lowpower Semiconductor inc LP6261AB6F Datasheet HTML 4Page - Lowpower Semiconductor inc LP6261AB6F Datasheet HTML 5Page - Lowpower Semiconductor inc LP6261AB6F Datasheet HTML 6Page - Lowpower Semiconductor inc LP6261AB6F Datasheet HTML 7Page - Lowpower Semiconductor inc  
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LP6261-02
Dec.-2019
Email: marketing@lowpowersemi.com
www.lowpowersemi.com
Page 3 of 7
Preliminary Datasheet
LP6261
Absolute Maximum Ratings
Note 1
VIN and EN to GND ----------------------------------------------------------------------------------------------------------- 6.5V
VOUT to GND --------------------------------------------------------------------------------------------------------------------- 8V
SW to GND ----------------------------------------------------------------------------------------------------------------------- 10V
Maximum Junction Temperature ----------------------------------------------------------------------------------------- 150°C
Operating Ambient Temperature Range (TA) --------------------------------------------------------------- -40℃ to 85°C
Maximum Soldering Temperature (at leads, 10 sec) --------------------------------------------------------------- 260°C
Note 1.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal Information
Maximum Power Dissipation (SOT23-6, PD,TA=25℃) ------------------------------------------------------------- 0.45W
Thermal Resistance (SOT23-6, JA) --------------------------------------------------------------------------------- 250℃/W
ESD Susceptibility
HBM(Human Body Mode) ---------------------------------------------------------------------------------------------------- 2KV
MM(Machine Mode) ---------------------------------------------------------------------------------------------------------- 200V



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