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Die Size (Unsawn)

1500 x 1050

59 x 41

µm

mils

Minimum Bond Pad Size

104 x 104

4.09 x 4.09

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Analog Temperature Sensor – LM135

Single-supply linear-output temperature sensor in bare die form



Wide temperature range: -55 to +150°C



0.5% typical accuracy at 25°C



Single-point calibration for high precision



Operates from 450μA to 5mA



<1Ω dynamic impedance



Linear output



Intermittent operation capability at 200°C



Small size for high integration

Rev 1.1

28/04/20

Features:

Supply Formats:

Mechanical Specification



Default – Die in Waffle Pack (400 per tray capacity)



Sawn Wafer on Tape – On request



Unsawn Wafer – On request



Die Thickness <> 350µm(14 Mils) – On request



Assembled into Hermetic Package – On request

The LM135 precision linear-output temperature sensor

is designed for simple calibration and ease of use.

Output is derived from an integrated 2-terminal Zener

with a breakdown voltage directly proportional to

absolute temperature at 10mV/°K. Calibrated at

+25°C, the LM135 has an accuracy of 0.5°C over a

wide -55°C to 150°C temperature range. With less

than 1Ω dynamic impedance, performance is

consistent across a current range of 450μA to 5mA.

The device suits use as a general purpose sensor

where its small size, low impedance and linear output

enables simple circuit integration.

Description

The following part suffixes apply:



No suffix - MIL-STD-883 /2010B Visual Inspection



“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT



“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

For a higher electrical grade version of this product see LM135A

Ordering Information

Die Dimensions in µm (mils)

1500 (59)