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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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TS39101CS датащи(PDF) 8 Page - Taiwan Semiconductor Company, Ltd |
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TS39101CS датащи(HTML) 8 Page - Taiwan Semiconductor Company, Ltd |
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8 / 10 page  TS39100/1/2/3 8-10 2004/06 rev. E Application Information (continues) Thermal resistance consists of two main elements, Θjc (junction to case) and Θca (case to ambient). Using the power SOP-8 reduces Θca, the total thermal resistance, Θja (junction to ambient) is the limiting factor in calculating the maximum power dissipation capability of the device. Typically, the power SOP-8 have a Θjc of 20 oC/W dramatically , this is significantly lower than the standard SOP-8 which is typically 75 oC/W. Θca is reduced because pin 5~8 can be soldered directly to a ground plane which significantly reduces the case to sink and sink to ambient thermal resistance. Power Dissipation From under curves, the minimum area of copper necessary for the par to operate safely can be determined. The maximum allowable temperature rise must be calculated to determine operation along which curve. |
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