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TMCS1101

SBOS825A – SEPTEMBER 2019 – REVISED MAY 2020

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Copyright © 2019–2020, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

GND – 0.3

6

V

NC Input

NC

GND – 0.3

V

Analog output

VOUT

GND – 0.3

V

Junction temperature

–65

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

±1000

(1)

(2)

Input current safe operating area is constrained by junction temperature. Recommended condition based on the TMCS1101EVM. Input

current rating is derated for elevated ambient temperatures.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

(1)

Input voltage

–600

600

Operating supply voltage, TMCS1101A1B-3U, A1U-3U

3

5

5.5

V

Operating supply voltage, TMCS1101A4B, A4U

4.5

5

5.5

V

(2)

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Applies when device mounted on TMCS1101EVM. For more details, see the Safe Operating Area section.

7.4 Thermal Information

UNIT

D (SOIC)

8 PINS

Junction-to-ambient thermal resistance

36.6

°C/W

Junction-to-case (top) thermal resistance

50.7

°C/W

Junction-to-board thermal resistance

9.6

°C/W

Junction-to-top characterization parameter

–0.1

°C/W

Junction-to-board characterization parameter

11.7

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W