TMCS1100 datasheet(39/50 Pages) TI1

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TMCS1100

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SBOS820A – SEPTEMBER 2019 – REVISED JUNE 2020

Product Folder Links: TMCS1100

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11 Power Supply Recommendations

The TMCS1100 only requires a power supply (VS) on the low-voltage isolated side, which powers the analog

circuitry independent of the isolated current input. VS determines the full-scale output range of the analog output

VOUT, and can be supplied with any voltage between 3 V and 5.5 V. To filter noise in the power-supply path,

place a low-ESR decoupling capacitor of 0.1 uF between VS and GND pins as close as possible to the supply

and ground pins of the device. To compensate for noisy or high-impedance power supplies, add more decoupling

capacitance.

The TMCS1100 power supply VS can be sequenced independently of current flowing through the input. However,

there is a typical 25ms delay between VS reaching the recommended operating voltage and the analog output

being valid. Within this delay VOUT transfers from a high impedance state to the active drive state, during which

time the output voltage could transition between GND and VS. If this behavior must be avoided, a stable supply

voltage to VS should be provided for longer than 25ms prior to applying input current.

12 Layout

12.1 Layout Guidelines

The TMCS1100 is specified for a continuous current handling capability on the TMCS1100EVM, which uses 3-oz

copper pour planes. This current capability is fundamentally limited by the maximum device junction temperature

and the thermal environment, primarily the PCB layout and design. To maximize current-handling capability and

thermal stability of the device, take care with PCB layout and construction to optimize the thermal capability.

Efforts to improve the thermal performance beyond the design and construction of the TMCS1100EVM can result

in increased continuous-current capability due to higher heat transfer to the ambient environment. Keys to

improving thermal performance of the PCB include:

•

Use large copper planes for both input current path and isolated power planes and signals.

•

Use heavier copper PCB construction.

•

Place thermal via farms around the isolated current input.

•

Provide airflow across the surface of the PCB.

The TMCS1100 senses external magnetic fields, so make sure to minimize adjacent high-current traces in close

proximity to the device. The input current trace can contribute additional magnetic field to the sensor if the input

current traces are routed parallel to the vertical axis of the package. Figure 51 illustrates the most optimal input

current routing into the TMCS1100. As the angle that the current approaches the device deviates from 0° to the

horizontal axis, the current trace contributes some additional magnetic field to the sensor, increasing the effective

sensitivity of the device. If current must be routed parallel to the package vertical axis, move the routing away

from the package to minimize the impact to the sensitivity of the device. Terminate the input current path directly

underneath the package lead footprint, and use a merged copper input trace for both the IN+ and IN– inputs.

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