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XT
April 1999
4.5.99
15
)6)6)6)6
/RZ6NHZ &ORFN)DQRXW%XIIHU ,&V
,62
Table 14: 28-pin SOIC (7.5mm/0.300") Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN.
MAX.
MIN.
MAX.
A
0.093
0.104
2.35
2.65
A1
0.004
0.012
0.10
0.30
A2
0.08
0.100
2.05
2.55
B
0.013
0.013
0.33
0.51
C
0.009
0.009
0.23
0.32
D
0.697
0.713
17.70
18.10
E
0.291
0.299
7.40
7.60
e
0.05 BSC
1.27 BSC
H
0.393
0.419
10.00
10.65
h
0.010
0.030
0.25
0.75
L
0.016
0.05
0.40
1.27
Θ
0
°
8
°
0
°
8
°
Be
D
A
1
SEATING PLANE
H
E
28
1
ALL RADII:
0.005" TO 0.01"
BASE PLANE
A
2
ÅÉ"ÇÅÃÇ"#)#$É#ÃÇ
C
L
7° typ.
θ
A
h x 45°
Table 15: 28-pin SOIC (7.5mm/0.300") Package Characteristics
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
TYP.
UNITS
Thermal Impedance, Junction to Free-Air
Θ
JA
Air flow = 0 m/s
80
°C/W
Lead Inductance, Self
L11
Center lead
2.5
nH
Lead Inductance, Mutual
L12
Center lead to any adjacent lead
0.85
nH
Lead Capacitance, Bulk
C11
Center lead to VSS
0.42
pF
Lead Capacitance, Mutual
C12
Center lead to any adjacent lead
0.08
pF