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Product data sheet

Rev. 01 — 23 June 2005

4 of 16

Philips Semiconductors

PBLS6002D

60 V PNP BISS loadswitch

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

(3) FR4 PCB, standard footprint

Fig 1.

Power derating curves

0

160

120

40

80

006aaa461

0.4

0.2

0.6

0.8

(W)

0

(1)

(2)

(3)

Table 6:

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device

thermal resistance from

junction to ambient

in free air

[1] -

-

312

K/W

[2] -

-

236

K/W

[3] -

-

208

K/W

thermal resistance from

junction to solder point

-

-

105

K/W