200

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SP0504BAC, SP0508BAC, SP0516BAC

Silicon Protection Circuits

TVS Avalanche Diode Array in a Unipolar Chip Scale Package

Pad Size on PCB

Pad Shape

Pad Definition

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperature Opening

Solder Flux Ratio

Solder Paste

Board Trace Finish

PARAMETER

Reverse Standoff Voltage

Reverse Standoff Leakage Current

Signal Clamp Voltage

Positive

Negative

Clamp Voltage during ESD

MIL-STD-883D Method 3015

ESD Test Level

IEC-61000-4-2, Contact discharge

MIL-STD-883D Method 3015 (HBM)

Capacitance

Turn on/off Time

Temperature Range

Operating

Storage

TEST CONDITIONS

I = 10µA

V = 5.5V

I = 10mA

I = 10mA

8kV Positive

8kV Negative

2.5VDC @ 1Mhz

MIN

± 5.5

5.6

- 1.2

25

30

- 40

- 65

MAX

-

10

8.0

- 0.4

85

150

UNITS

V

µA

V

V

V

V

kV

kV

pF

ns

°C

°C

TYPICAL

-

6.6

- 0.8

12

- 8

39

<1

0

48

97

Time (s)

145

194

242

290

339

387

435

EXH

CD

RF

Z

Z4

Z3

Z2

PH

EXH

250

225

200

175

150

125

100

75

50

25

0.300mm

Round

Non-Solder Mask

Defined Pads

(NSMD)

0.350mm

0.152mm

0.360mm (sq)

50/50

No Clean

OSP (Entek Cu

Plus 106A)

PRINTED CIRCUIT BOARD RECOMMENDATIONS

Typical Solder Reflow Thermal Profile (No Clean Flux)

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