| поискавой системы для электроныых деталей |
|
SSM6P35AFE датащи(PDF) 3 Page - Toshiba Semiconductor |
|
|
|||||||||||||||||||||||||||||
SSM6P35AFE датащи(HTML) 3 Page - Toshiba Semiconductor |
|
3 / 8 page ![]() SSM6P35AFE 3 5. 5. 5. 5. Electrical Characteristics Electrical Characteristics Electrical Characteristics Electrical Characteristics 5.1. 5.1. 5.1. 5.1. Static Characteristics (Unless otherwise specified, T Static Characteristics (Unless otherwise specified, T Static Characteristics (Unless otherwise specified, T Static Characteristics (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25 )(Q1, Q2 Common) )(Q1, Q2 Common) )(Q1, Q2 Common) )(Q1, Q2 Common) Characteristics Gate leakage current Drain cut-off current Drain-source breakdown voltage Drain-source breakdown voltage Gate threshold voltage Drain-source on-resistance Forward transfer admittance (Note 1) (Note 2) (Note 3) (Note 3) Symbol IGSS IDSS V(BR)DSS V(BR)DSX Vth RDS(ON) |Yfs| Test Condition VDS = 0 V, VGS = ±10 V VDS = -20 V, VGS = 0 V ID = -1 mA, VGS = 0 V ID = -1 mA, VGS = 10 V VDS = -10 V, ID = -100 µA ID = -10 mA, VGS = -1.2 V ID = -20 mA, VGS = -1.5 V ID = -50 mA, VGS = -1.8 V ID = -150 mA, VGS = -2.5 V ID = -150 mA, VGS = -4.5 V VDS = -10 V, ID = -100 mA Min -20 -10 -0.3 Typ. 3.2 2.3 2.0 1.5 1.1 430 Max ±1 -1 -1 20 4.0 2.9 2.1 1.4 Unit µA V Ω mS Note 1: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain- source breakdown voltage is lowered in this mode. Note 2: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (-100 µA for this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON). Take this into consideration when using the device. Note 3: Pulse measurement. 5.2. 5.2. 5.2. 5.2. Dynamic Characteristics (Unless otherwise specified, T Dynamic Characteristics (Unless otherwise specified, T Dynamic Characteristics (Unless otherwise specified, T Dynamic Characteristics (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25 )(Q1, Q2 Common) )(Q1, Q2 Common) )(Q1, Q2 Common) )(Q1, Q2 Common) Characteristics Input capacitance Reverse transfer capacitance Output capacitance Switching time (rise time) Switching time (turn-on delay time) Switching time (fall time) Switching time (turn-off delay time) Symbol Ciss Crss Coss tr td(on) tf td(off) Test Condition VDS = -10 V, VGS = 0 V, f = 1 MHz VDD = -10 V, ID = -50 mA, VGS = 0 to -4.5 V, RG = 10 Ω Duty ≤ 1%, VIN: tr, tf < 5 ns, Common source, See Chapter 5.3. Min Typ. 21 2 6 42 17 145 420 Max 42 Unit pF ns 5.3. 5.3. 5.3. 5.3. Switching Time Test Circuit Switching Time Test Circuit Switching Time Test Circuit Switching Time Test Circuit Fig. Fig. Fig. Fig. 5.3.1 5.3.1 5.3.1 5.3.1 Switching Time Test Circuit Switching Time Test Circuit Switching Time Test Circuit Switching Time Test Circuit Fig. Fig. Fig. Fig. 5.3.2 5.3.2 5.3.2 5.3.2 Input Waveform/Output Waveform Input Waveform/Output Waveform Input Waveform/Output Waveform Input Waveform/Output Waveform 2017-06-22 Rev.2.0 ©2017 Toshiba Corporation |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |