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TMP63 датащи(PDF) 4 Page - Texas Instruments |
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TMP63 датащи(HTML) 4 Page - Texas Instruments |
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4 / 22 page ![]() 4 TMP63-Q1 SNIS215 – JANUARY 2020 www.ti.com Product Folder Links: TMP63-Q1 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage across pins 2 (+) and 1(–) +6 V Current through the device +450 µA Junction temperature (TJ) –40 +150 °C Storage temperature (Tstg) –65 +150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM) per per AEC Q100-002 (1) HBM classification level H2 ±2000 V Charged device model (CDM), per AEC Q100- 011 CDM classification level C6 ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VSns Voltage across pins 2 (+) and 1 (–) 0 5.5 V ISns Current through the device 0 400 µA TA Operating free-air temperature (specified performance) (X1SON/DEC Package) –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5. (3) Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance. 6.4 Thermal Information THERMAL METRIC (1) TMP63 Units DEC (X1SON) 2 PINS RθJA Junction-to-ambient thermal resistance(2)(3) 443.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 195.7 °C/W RθJB Junction-to-board thermal resistance 254.6 °C/W ΨJT Junction-to-top characterization parameter 19.9 °C/W ΨJB Junction-to-board characterization parameter 254.5 °C/W RθJC(bot) Junction-to-case (bot) thermal resistance – °C/W |
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