ATS673 datasheet(18/20 Pages) ALLEGRO

18 / 20 page

ATS673LSE-DS

Worcester, Massachusetts 01615-0036 (508) 853-5000

115 Northeast Cutoff, Box 15036

www.allegromicro.com

Allegro MicroSystems, Inc.

Self-Calibrating TPOS Gear Tooth Sensor Optimized for Automotive Cam Sensing Applications

ATS673 and ATS674

The device must be operated below the maximum junction

temperature of the device, TJ(max). Under certain combinations of

peak conditions, reliable operation may require derating sup-

plied power or improving the heat dissipation properties of the

application. This section presents a procedure for correlating

factors affecting operating TJ. (Thermal data is also available on

the Allegro MicroSystems Web site.)

The Package Thermal Resistance, RθJA, is a figure of merit sum-

marizing the ability of the application and the device to dissipate

heat from the junction (die), through all paths to the ambient air.

Its primary component is the Effective Thermal Conductivity,

K, of the printed circuit board, including adjacent devices and

traces. Radiation from the die through the device case, RθJC, is

relatively small component of RθJA. Ambient air temperature,

TA, and air motion are significant external factors, damped by

overmolding.

The effect of varying power levels (Power Dissipation, PD), can

be estimated. The following formulas represent the fundamental

relationships used to estimate TJ, at PD.

PD = VIN

× IIN

(1)

∆T = PD

× RθJA

(2)

TJ = TA + ∆T

(3)

For example, given common conditions such as: TA= 25°C,

VIN = 12 V, IIN = 4 mA, and RθJA = 140 °C/W, then:

PD = VIN

× IIN = 12 V × 4 mA = 48 mW

∆T = PD

× RθJA = 48 mW × 140 °C/W = 7°C

TJ = TA + ∆T = 25°C + 7°C = 32°C

A worst-case estimate, PD(max), represents the maximum allow-

able power level, without exceeding TJ(max), at a selected RθJA

and TA.

Example: Reliability for VCC at TA=150°C, package SE, using

minimum-K PCB.

Observe the worst-case ratings for the device, specifically:

RθJA=101°C/W, TJ(max) =165°C, VCC(max)=26.5V, and

ICC(max) = 11 mA. Note that ICC(max) at TA=150°C is lower than

the ICC(max) at TA=25°C given in the Operating Characteristics

table.

Calculate the maximum allowable power level, PD(max). First,

invert equation 3:

∆Tmax = TJ(max) – TA = 165°C–150°C = 15°C

This provides the allowable increase to TJ resulting from internal

power dissipation. Then, invert equation 2:

PD(max) = ∆Tmax÷RθJA =15°C÷101 °C/W=91mW

Finally, invert equation 1 with respect to voltage:

VCC(est) = PD(max) ÷ ICC(max)= 91mW÷11mA=8.3 V

The result indicates that, at TA, the application and device can

dissipate adequate amounts of heat at voltages ≤VCC(est).

Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-

able operation between VCC(est) and VCC(max) requires enhanced

RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and

VCC(max) is reliable under these conditions.

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