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TMPA404010S-100MN-R32 датащи(PDF) 1 Page - TAI-TECH Advanced Electronics Co., Ltd.

номер детали TMPA404010S-100MN-R32
подробное описание детали  SMD Power Inductor
PDF  2 Pages
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производитель  TAI-TECH [TAI-TECH Advanced Electronics Co., Ltd.]
домашняя страница  https://www.tai-tech.com.tw/en/
Logo TAI-TECH - TAI-TECH Advanced Electronics Co., Ltd.

TMPA404010S-100MN-R32 датащи(HTML) 1 Page - TAI-TECH Advanced Electronics Co., Ltd.

  TMPA404010S-100MN-R32 Datasheet HTML 1Page - TAI-TECH Advanced Electronics Co., Ltd. TMPA404010S-100MN-R32 Datasheet HTML 2Page - TAI-TECH Advanced Electronics Co., Ltd.  
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TAI-TECH
1. Features
2. Applications
3. Dimensions
A
B
C
E
D
100
F
T
4. Part Numbering
5. Specification
TMPA404010S-100MN-R32
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
TMPA
404010
S
-
100
MN
- R32
A
B
C
D
E
F
A: Series
B: Dimension
BxC
C: Type
Standard.
D: Inductance
100=10uH
E: Inductance Tolerance
M=±20%
F: DCR
Marking: Black.100 Unidirectional printing.
SMD Power Inductor
Recommend PC Board Pattern
L
G
L(mm)
G(mm)
H(mm)
4.4
2.2
2.0
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.12mm and above.
Series
A
B
C
D
E
F
T
TMPA404010 4.20±0.20 4.15±0.20 0.83±0.2 0.9±0.20 1.8±0.20 2.4±0.20 0~0.05
Unit:mm
Halogen-free
Halogen
Part Number
Inductance
L0 A(uH)
±20%
Heat Rating
Current DC
Irms ( A )
Saturation
Current DC
I sat ( A )
DCR
(mΩ)Typ.
DCR
(mΩ)Max.
Typ
Max
Typ
Max
TMPA404010S-100MN-R32
10.0
1.6
1.4
2.0
1.7
300.0
320.0
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
1. Shielded construction.
2. Capable of corresponding high frequency .
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6.
100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
8.


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