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DP8418 датащи(PDF) 12 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали DP8418
подробное описание детали  64k, 256k Dynamic RAM Controller/Drivers
PDF  28 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

DP8418 датащи(HTML) 12 Page - National Semiconductor (TI)

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DP8419 Mode Descriptions (Continued)
The Refresh Request on RFIO is terminated as RAS goes
low This signal may be used to end the refresh earlier than
it normally would as described above If M2 is pulled high
while the RAS lines are low then the RASs go high tRFRH
later The designer must be careful however not to violate
the minimum RAS low time of the DRAMs He must also
guarantee that the minimum RAS precharge time is not vio-
lated during a transition from mode 1 to mode 5 when an
access is desired immediately following a refresh
If the processor tries to access memory while the DP8419 is
in mode 1 WAIT states should be inserted into the proces-
sor cycles until the DP8419 is back in mode 5 and the de-
sired access has been accomplished (see
Figure 9 )
Instead of using WAIT states to delay accesses when re-
freshing HOLD states could be used as follows RFRQ
could be connected to a HOLD or Bus Request input to the
system When convenient the system acknowledges the
HOLD or Bus Request by pulling M2 low
Using this
scheme HOLD will end as the RAS lines go low (RFIO
goes high) Thus there must be sufficient delay from the
time HOLD goes high to the DP8419 returning to mode 5 so
that the RAS low time of the DRAMs isn’t violated as de-
scribed earlier (see
Figure 3 for mode 1 refresh with Hold
states)
To perform a forced refresh the system will be inactive for
about four periods of RGCK For a frequency of 10 MHz
this is 400 ns To refresh 128 rows every 2 ms an average of
about one refresh per 16 ms is required With a RFCK period
of 16 ms and RGCK period of 100 ns DRAM accesses are
delayed due to refresh only 25% of the time If using the
Hidden Refresh available in mode 5 (refreshing with RFCK
high) this percentage will be even lower
MODE 4 - EXTERNALLY CONTROLLED ACCESS
In this mode all control signal outputs can be controlled
directly by the corresponding control input The enabled
RAS output follows RASIN CAS follows CASIN (with RC
low) WE follows WIN and RC determines whether the row
or the column inputs are enabled to the address outputs
(see
Figure 4 )
With RC high the row address latch contents are enabled
onto the address bus RAS going low strobes the row ad-
dress into the DRAMs After waiting to allow for sufficient
row-address hold time (tRAH) after RAS goes low RC can
go low to enable the column address latch contents onto
the address bus When the column address is valid CAS
going low will strobe it into the DRAMs WIN determines
whether the cycle is a read write or read-modify-write ac-
cess Refer to
Figures 5a and 5b for typical Read and Write
timing using mode 4
Resistors
required
depends
on
DRAM load
DRAMs Maybe 16k 64k or 256k
For 4 Banks can drive 16 data bits
a
6 Check Bits for ECC
For 2 Banks can drive 32 data bits
a
7 Check Bits for ECC
For 1 Bank can drive 64 data bits
a
8 Check Bits for ECC
TLF8396 – 12
FIGURE 4 Typical Application of DP8419 Using External Control Access and Refresh in Modes 0 and 4
12



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