PUSB2X4Y

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© NXP B.V. 2013. All rights reserved.

Product data sheet

Rev. — 5 November 2013

7 of 11

NXP Semiconductors

PUSB2X4Y

ESD protection for high-speed interfaces

8.

Soldering

Fig 9.

Reflow soldering footprint SOT363 (SC-88)

Fig 10. Wave soldering footprint SOT363 (SC-88)

solder lands

solder resist

occupied area

solder paste

sot363_fr

2.65

2.35

0.4 (2

×)

0.6

(2

×)

0.5

(4

×)

0.5

(4

×)

0.6

(4

×)

0.6

(4

×)

1.5

1.8

Dimensions in mm

sot363_fw

solder lands

solder resist

occupied area

preferred transport

direction during soldering

5.3

1.3

1.3

1.5

0.3

1.5

4.5

2.45

2.5

Dimensions in mm