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Nat Conv

PTH12060W/L

SLTS217D–MAY 2003–REVISED OCTOBER 2005

EFFICIENCY

OUTPUT RIPPLE

vs

vs

OUTPUT CURRENT

OUTPUT CURRENT

Figure 5.

Figure 6.

POWER DISSIPATION

TEMPERATURE DERATING

vs

vs

OUTPUT CURRENT

OUTPUT CURRENT

Figure 7.

Figure 8.

(1) Characteristic data has been developed from actual products tested at 25°C. This data is considered typical data for the Converter.

(2) SOA graphs represent the conditions at which internal components are at or below the manufacturer's maximum operating

temperatures. Derating limits apply to modules soldered directly to a 4 in × 4 in, double-sided PCB with 1 oz copper. For surface mount

products (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power pins. Please refer

8