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STM32MP157C датащи(PDF) 239 Page - STMicroelectronics |
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STM32MP157C датащи(HTML) 239 Page - STMicroelectronics |
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239 / 258 page ![]() DS12505 Rev 2 239/258 STM32MP157C Package information 254 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 TFBGA 257 package information Figure 64. TFBGA - 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch ball grid array package outline 1. Drawing is not to scale. B02Y_ME_V1 D E F1 e1 e2 F2 E2 E1 F1 e2 F2 D2 D1 K H D A B C E F G J L M N P R U T V W A B 1H 1D 1A 1B 1C 1E 1F 1G 1J Peripheral ball matrix pitch 0.5 mm Central ball matrix pitch 0.65 mm 1 2 3 4 5 6 7 8 9 10 11 12 15 13 14 16 17 18 19 1 2 3 4 5 6 7 8 9 A1 ball pad corner b (257 balls) eee M C A B fff M C A A1 A2 SEATING PLANE C ddd C BOTTOM VIEW TOP VIEW SIDE VIEW e1 |
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