© 2018 Microchip Technology Incorporated

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pitch

X2

0.60

MILLIMETERS

1.05 BSC

MIN

E

MAX

Contact Pad Length (X20)

Contact Pad Width (X20)

Y

X1

0.80

1.00

NOM

SILK SCREEN

12

6

C

Contact Pad Spacing

2.00

Contact Pad to Contact Pad (X3)

G1

0.75

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

CH

G1

C

X1

X2

G2

E

Y

Contact Pad to Contact Pad (X4)

G2

0.25

Terminal 1 Corner Chamfer

CH

0.28

Microchip Technology Drawing C04-03252 Rev A

6-Lead Very Thin Plastic Dual Flat, No Lead Package (KDA) - 3.2x2.5 mm Body [VDFN]

With Stepped Wettable Flanks

 2019 Microchip Technology Inc.

DS20005891A-page 21

DSA1103/23