MLV_VZ datasheet(4/49 Pages) WALSIN

4 / 49 page

Approval sheet

Page 4 of 7

ASC_VZ0402 Green Series- V14

Aug. 2018

Chip varistor

SPECIFICATION

Electrical Reliability

Test item

Test condition / Test method

Specification

High temperature storage

+125±3℃ for 1000 hours

Measurement to be made after keeping at room temp. for 24 ±2hr

△V at 1mA ＜ 10%

Low temperature storage

-40±3℃ for 1000 hours

Measurement to be made after keeping at room temp. for 24 ±2hr

△V at 1mA ＜ 10%

Humidity storage

40±2℃ , 90 ~95%RH for 500 hours

Measurement to be made after keeping at room temp. for 24 ±2hr

△V at 1mA ＜ 10%

Temperature cycles

Times：5 cycles

Step

Temp.(℃)

Time(min.)

-55±3

30±3

room temp.

2~3

+125±3℃

30±2

room temp.

2~3

Measurement to be made after keeping at room temp. for 24 ±2hr

△V at 1mA ＜ 10%

Mechanical Reliability

Test item

Test condition / Test method

Specification

Solderability

Solder temp.：230±5

C

Immersion time：2±0.5 sec

Immersion and emersion rates：25mm/s

Min 90% electrode shall

be covered with solder.

Resistance to Soldering Heat

Pre-heating：120~ 150℃ , 60 sec

Solder temp.：260±5

C

Immersion time：10±1 sec

Measurement to be made after keeping at room temp. for 24 ±2h

△V at 1mA ＜ 10%

Disappearance of

electrode due to

immersion into solder

shall not exceed 25% of

edges of each

electrode.

Adhesive Strength of

Termination

Solder chip on PCB and applied

0805/1206 Series: 10N(1Kgf) for 10 sec

No visible damage

0402/0603 Series: 5N(0.5Kgf) for 10 sec

Vibration

Solder chip on PCB.

Frequency：10 Hz～55 Hz～10 Hz (1min)

Oscillation amplitude：1.5 mm

Times：2 hrs in each of three perpendicular direction

No visible damage

Bending Test

The middle part of substrate shall be pressurized by means of the

pressurizing rod at a rate of 1mm per second until the deflection becomes 1

mm and then the pressure shall be maintained for 5 sec..

No visible damage

△V at 1mA ＜ 10%

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