Approval sheet

Page 6 of 7

ASC_WW25R_V09

MAY -2015

TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

TEST

PROCEDURE

REQUIREMENT

Dimension

Resistance

Clause 4.4.2

The resistance should be

within specified tolerance per

resistance value!

Temperature Coefficient of

Resistance(T.C.R)

Clause 4.8

Natural resistance change per change in degree centigrade.

(

)

6

1

2

1

1

2

10

×

−

−

t

t

R

R

R

(ppm/

Refer to

“QUICK REFERENCE DATA”

Short time overload (S.T.O.L)

Clause 4.13

Permanent resistance change after a 2 second application of a

voltage 2.5 times RCWC or the maximum operation current

specified in the above list, whichever is less.

no visible damage

∆R/R max. ±(1%+0.0001Ω)

Resistance to soldering

heat(R.S.H)

IEC 60068-2-58: 2004

Un-mounted chips completely immersed for 10±0.5 second in a

SAC solder bath at 260℃±5ºC

no visible damage

∆R/R max. ±(1%+0.0001Ω)

Solderability

IEC 60068-2-58: 2004

SAC solder bath at 235℃±5℃

good tinning (>95% covered)

no visible damage

WW25R

0.5