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WF10A датащи(PDF) 5 Page - WALSIN TECHNOLOGY CORPORATION |
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WF10A датащи(HTML) 5 Page - WALSIN TECHNOLOGY CORPORATION |
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5 / 7 page ![]() Approval sheet Page 5 of 7 ASC_WF10A_V02 MAY - 2016 CATALOGUE NUMBERS The resistors have a catalogue number starting with . WF10 A 1202 F T L Size code WF10: 1210 Type code A : Power 3/4W Resistance code 5%, E24: 2 significant digits followed by no. of zeros 100 = 101_ 10K = 103 1%, E24+E96: 3 significant digits followed by no. of zeros 100 =1000 37.4K =3742 Tolerance F: 1% J: 5% Packaging code T: 7 ” Reeled taping Termination code L = Sn base (lead free) Reeled tape packaging : 8mm width paper taping 5000pcs per 7 ” reel. TEST AND REQUIREMENTS(JIS C 5201-1 : 1998) Basic specification : The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions according to IEC 68-1, subclause 5.3, unless otherwise specified. Temperature: 15ºC to 35ºC. Relative humidity: 45% to 75%. Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar). TEST PROCEDURE / TEST METHOD REQUIREMENT Resistor DC resistance Clause 4.5 DC resistance values measured at the test voltages specified below : <10 @0.1V, <100 @0.3V, <1K@1.0V, <10K @3V, <100K @10V, <1M@25V, <10M@30V Within the specified tolerance Temperature Coefficient of Resistance(T.C.R) Clause 4.8 Natural resistance change per change in degree centigrade. 6 1 2 1 1 2 10 t t R R R (ppm/ C) t 1 : 20°C+5°C-1°C R1 : Resistance at reference temperature R2 : Resistance at test temperature Refer to “QUICK REFERENCE DATA” Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 2 second application of a voltage 2.5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. R/R max. (1%+0.05) Resistance to soldering heat (R.S.H) Clause 4.18 Un-mounted chips completely immersed for 10±1second in a SAC solder bath at 260℃±5ºC ΔR/R max. ±(1%+0.05Ω) no visible damage Solderability Clause 4.17 Un-mounted chips completely immersed for 2±0.5 second in a SAC solder bath at 235℃±5℃ 95% coverage min., good tinning and no visible damage |
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