LM323, A

2

MOTOROLA ANALOG IC DEVICE DATA

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Input Voltage

Vin

20

Vdc

Power Dissipation

PD

Internally Limited

W

Operating Junction Temperature Range

TJ

0 to +125

°C

Storage Temperature Range

Tstg

–65 to +150

°C

Lead Temperature (Soldering, 10 s)

Tsolder

300

°C

LM323A

LM323

Characteristics

Symbol

Min

Typ

Max

Min

Typ

Max

Unit

Output Voltage

(Vin = 7.5 V, 0 ≤ Iout ≤ 3.0 A, TJ = 25°C)

VO

4.9

5.0

5.1

4.8

5.0

5.2

V

Output Voltage

(7.5 V

≤ Vin ≤ 15 V, 0 ≤ Iout ≤ 3.0 A,

P

≤ Pmax) (Note 2)

VO

4.8

5.0

5.2

4.75

5.0

5.25

V

Line Regulation

(7.5 V

≤ Vin ≤ 15 V, TJ = 25°C) (Note 3)

Regline

–

1.0

15

–

1.0

25

mV

Load Regulation

(Vin = 7.5 V, 0 ≤ Iout ≤ 3.0 A, TJ = 25°C)

(Note 3)

Regload

–

10

50

–

10

100

mV

Thermal Regulation

(Pulse = 10 ms, P = 20 W, TA = 25°C)

Regtherm

–

0.001

0.01

–

0.002

0.03

%VO/W

Quiescent Current

(7.5 V

≤ Vin ≤ 15 V, 0 ≤ Iout ≤ 3.0 A)

IB

–

3.5

10

–

3.5

20

mA

Output Noise Voltage

(10 Hz

≤ f ≤ 100 kHz, TJ = 25°C)

VN

–

40

–

–

40

–

µVrms

Ripple Rejection

(8.0 V

≤ Vin ≤ 18 V, Iout = 2.0A,

f = 120 Hz, TJ = 25°C)

RR

66

75

–

62

75

–

dB

Short Circuit Current Limit

(Vin = 15 V, TJ = 25°C)

(Vin = 7.5 V, TJ = 25°C)

ISC

–

–

4.5

5.5

–

–

–

–

4.5

5.5

–

–

A

Long Term Stability

S

–

–

35

–

–

35

mV

Thermal Resistance, Junction–to–Case (Note 4)

R

ΘJC

–

2.0

–

–

2.0

–

°C/W

NOTES: 1. Tlow to Thigh = 0° to +125°C

2. Although power dissipation is internally limited, specifications apply only for P

≤ Pmax = 25 W.

3. Load and line regulation are specified at constant junction temperature. Pulse testing is required with a pulse width

≤ 1.0 ms and a duty cycle ≤ 5%.

4. Without a heatsink, the thermal resistance (R

θJA is 65°C/W). With a heatsink, the effective thermal resistance can approach the specified values of

2.0

°C/W, depending on the efficiency of the heatsink.