NFSW757HT datasheet(36/41 Pages) NICHIA

36 / 41 page

NICHIA STS-DA1-5625 <Cat.No.190328>

RELIABILITY

(1) Tests and Results

Test

Reference

Standard

Test Conditions

Test

Duration

Failure

Criteria

Units

Failed/Tested

Resistance to

Soldering Heat

(Reflow Soldering)

JEITA ED-4701

300 301

Tsld=260°C, 10sec, 2reflows,

Precondition: 30°C, 70%RH, 168hr

0/22

Solderability

(Reflow Soldering)

JEITA ED-4701

303 303A

Tsld=245±5°C, 5sec,

Lead-free Solder(Sn-3.0Ag-0.5Cu)

0/22

Temperature Cycle

JEITA ED-4701

100 105

-40°C(30min)~25°C(5min)~

100°C(30min)~25°C(5min)

100cycles

0/50

Moisture Resistance

(Cyclic)

JEITA ED-4701

200 203

25°C~65°C~-10°C, 90%RH,

24hr per cycle

10cycles

0/22

High Temperature

Storage

JEITA ED-4701

200 201

TA=100°C

1000hours

0/22

Temperature Humidity

Storage

JEITA ED-4701

100 103

TA=60°C, RH=90%

1000hours

0/22

Low Temperature

Storage

JEITA ED-4701

200 202

TA=-40°C

1000hours

0/22

Room Temperature

Operating Life

Condition 1

TA=25°C, IF=65mA

Test board: See NOTES below

1000hours

0/22

Room Temperature

Operating Life

Condition 2

TA=25°C, IF=180mA

Test board: See NOTES below

500hours

0/22

High Temperature

Operating Life

TA=100°C, IF=70mA

Test board: See NOTES below

1000hours

0/22

Temperature Humidity

Operating Life

60°C, RH=90%, IF=65mA

Test board: See NOTES below

500hours

0/22

Low Temperature

Operating Life

TA=-40°C, IF=65mA

Test board: See NOTES below

1000hours

0/22

Vibration

JEITA ED-4701

400 403

200m/s

2, 100~2000~100Hz,

4cycles, 4min, each X, Y, Z

48minutes

0/22

Electrostatic Discharges

JEITA ED-4701

300 304

HBM, 2kV, 1.5k

Ω, 100pF, 3pulses,

alternately positive or negative

0/22

Board Bending

1bend to a deflection of 2mm

for 5±1sec

0/22

Soldering Joint Shear

Strength

JEITA ED-4702B

002 3

5N, 10±1sec

0/22

NOTES:

1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈76°C/W

The Board Bending is performed using an exclusive test board.

2) Measurements are performed after allowing the LEDs to return to room temperature.

(2) Failure Criteria

Criteria #

Items

Conditions

Failure Criteria

Forward Voltage(VF)

IF=65mA

>U.S.L.×1.1

Luminous Flux(

IF=65mA

<L.S.L.×0.7

Solderability

Less than 95% solder coverage

Appearance

The light emission is abnormal

U.S.L. : Upper Specification Limit

L.S.L. : Lower Specification Limit

NFSW757HT датащи(PDF) 36 Page - NICHIA CORPORATION

NFSW757HT датащи(HTML) 36 Page - NICHIA CORPORATION

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41

датащи скачать

ссылки URL