PCD6003H datasheet(2/96 Pages) PHILIPS

2 / 96 page

2001 Apr 17

Philips Semiconductors

Product speciﬁcation

Digital telephone answering machine chip

PCD6003

CONTENTS

FEATURES

APPLICATION SUMMARY

2.1

Metalink emulation

GENERAL DESCRIPTION

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING INFORMATION

6.1

Pinning

6.2

Pin description

6.3

Pin types

FUNCTIONAL DESCRIPTION

7.1

Architecture

7.2

I/O summary

7.3

Overview of functional description

POWER SUPPLY, RESET AND START-UP

8.1

Power supply

8.2

Reset and start-up

TICB - GENERATION AND SELECTION OF

SYSTEM CLOCKS

9.1

Microprocessor, DSP, CODEC and IOM clock

generation

9.2

System clocks

9.3

Real-Time Clock generation

THE MICROCONTROLLER

10.1

Microcontroller architecture

10.2

Memory mapping

10.3

SFR mapping

10.4

Microcontroller interrupts

10.5

Interface to DSP

10.6

Interface to Real-Time Clock (RTC)

10.7

Interface to the Memory Control Block (MCB)

10.8

The test registers CDTRx, PMTRx and TCTRL

10.9

Interface to Timing and Control Block (TICB)

10.10

Power and Interrupt Control Register (PCON)

10.11

I2C-bus

10.12

MSK modem

10.13

LE control

DSP I/O REGISTERS

11.1

Interface to CODEC

EXTERNAL MEMORY INTERFACE

12.1

Supported flash memories

12.2

DTAM external interface during target

debugging

THE CODECs

13.1

Definitions

13.2

CODEC architecture

ANALOG VOLTAGE REFERENCE (AVR)

14.1

Bandgap reference

14.2

Analog Voltage Source (AVS)

IOM

15.1

Features

15.2

Pin description

15.3

Functional description

15.4

IOM data buffers

15.5

IOM Control Register (IOMC)

15.6

Timing

EXTERNAL I/O INTERFACES

16.1

External analog interfaces

16.2

External digital Interfaces

ELECTRICAL CHARACTERISTICS

17.1

Limiting values

17.2

Supply characteristics

17.3

Digital I/O

17.4

Analog supplies and general purpose ADC and

DAC

17.5

CODECs

APPLICATION DIAGRAMS

PACKAGE OUTLINE

SOLDERING

20.1

Introduction to soldering surface mount

packages

20.2

Reflow soldering

20.3

Wave soldering

20.4

Manual soldering

20.5

Suitability of surface mount IC packages for

wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

PURCHASE OF PHILIPS I2C COMPONENTS

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