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ATS668LSM датащи(PDF) 11 Page - Allegro MicroSystems

номер детали ATS668LSM
подробное описание детали  True Zero-Speed High-Accuracy Gear Tooth Sensor IC
PDF  13 Pages
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производитель  ALLEGRO [Allegro MicroSystems]
домашняя страница  http://www.allegromicro.com
Logo ALLEGRO - Allegro MicroSystems

ATS668LSM датащи(HTML) 11 Page - Allegro MicroSystems

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True Zero-Speed High-Accuracy
Gear Tooth Sensor IC
ATS668LSM
11
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro website.)
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × IIN
(1)
Δ
T = PD × RθJA
(2)
TJ = TA + ΔT
(3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 6.5 mA, and RθJA = 147°C/W, then:
PD = VCC × ICC = 12 V × 6.5 mA = 78 mW
Δ
T = PD × RθJA = 78 mW × 147°C/W = 11.5°C
TJ = TA + ΔT = 25°C + 11.5°C = 36.5°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding
TJ(max), at a selected RθJA and TA.
Example: Reliability for VCC at TA=150°C.
Observe the worst-case ratings for the device, specifically:
RθJA=147°C/W, TJ(max) =165°C, VCC(max) = 24 V, and
ICC(max) = 12 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Δ
Tmax = TJ(max) – TA = 165°C–150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = ΔTmax÷RθJA=15°C÷147°C/W=102 mW
Finally, invert equation 1 with respect to voltage:
  VCC(est) = PD(max) ÷ ICC(max)= 102 mW÷12 mA=8.5 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then
reliable operation between VCC(est) and VCC(max) requires
enhanced RθJA. If VCC(est) ≥ VCC(max), then operation between
VCC(est) and VCC(max) is reliable under these conditions.
POWER DERATING



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