GS2989

Final Data Sheet

Rev.6

GENDOC-052133

July 2015

17 of 20

Semtech

www.semtech.com

6.2 Recommended PCB Footprint

Figure 6-2: Recommended PCB Footprint

The Center Pad should be connected to the most negative power supply plane (VEE) by

a minimum of 5 vias.

Note: Suggested dimensions only. Final dimensions should conform to customer

design rules and process optimizations.

6.3 Packaging Data

0.35

0.55

2.76

3.70

2.76

3.70

NOTE: All dimensions

are in millimeters.

0.65

CENTER PAD

Table 6-1: Packaging Data

Parameter

Value

Package type / dimensions / pad pitch

16-pin QFN / 4mm x 4mm /

0.65mm

Package Drawing Reference

JEDEC M0220

Moisture Sensitivity Level

3

Junction to Case Thermal Resistance,

31.0°C/W

Junction to Air Thermal Resistance,

43.8°C/W

Psi,

Ψ

11.0°C/W

Pb-free and RoHS compliant, Halogen-free

Yes