Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

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Copyright © 2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc.

9

Cree 4-mm Oval LED

C4SMB-RGY/GGY/BGY

REFLOW SOLDERING

The LED soldering specification is shown below(suitable for both leaded solder & lead-free solder):

Manual Soldering

Solder Dipping

Soldering iron

35 W max

Preheat

110 ºC max

Temperature

300 ºC max

Preheat time

60 seconds max

Solder-bath temperature 260 ºC Max

Soldering time

3 seconds max

Dipping time

5 seconds max

Position

Not less than 3 mm from the base of the package.

Position

Not less than 3 mm from the base of the package.

• Manual soldering onto the PCB is not recommended because soldering time is uncontrollable.

• The recommended wave soldering is as below:

10

20

30

40

50

60

70

80

90

100

110

120

0

30

150

100

300

250

200

50

Times (sec)

laminar wave

Fluxing

Preheat

•

Do not apply any stress to the LED package, particularly when heated.

•

Only bottom preheat is suggested & should not preheat on top in order to reduce thermal stress experienced by the

LEDs.

•

The LEDs must not be re used once they have been extracted from PCB.

•

After soldering the LEDs, the package should be protected from mechanical shock or vibration until the LEDs have

reached 40 ºC or below.

•

Precautions must be taken as mechanical stress on the LEDs may be caused by PCB warpage or from the clinching

and cutting of the LED leads.

•

When it is necessary to clam the LEDs during soldering, it is important to ensure no mechanical stress is exerted on

the LEDs.

•

Cut the LED lead at normal room temperature. Lead cutting at high temperature may cause failure of the LEDs.

Refer to "http://www.cree.com/led-components/media/documents/sh-HB.pdf" for soldering & handling details.