2

Technical Data 10673

Effective June 2018

FP2207R

High frequency, high current power inductors

www.eaton.com/electronics

Product Specifications

(nH) ±10%

minimum

I

rms

3

(A)

I

4

(A)

I

5

(A)

I

6

(A)

DCR (mΩ)

±15% @ +20 °C

R1 Version

FP2207R1-R230-R

230

196

50

70

77

72

0.47

182.5

1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 °C

2. Full Load Inductance (FLL) Test Parameters: 1.0 MHz, 0.1 Vrms, I

3. I

necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat

generating components will affect the temperature rise. It is recommended that the temperature of the

part not exceed +125 °C under worst case operating conditions verified in the end application.

4. I

5. I

6. I

L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).

8. Part Number Definition: FP2207Rx-Rxxx-R

FP2207R= Product code and size

x= Version indicator

Rxxx= Inductance value in μH, R= decimal point

-R suffix = RoHS compliant

Note: Hipot: 250 Vdc minimum for 2 seconds, 0.1 mA

conductor to uncoated core (test points c to d)

Dimensions (mm)

Part marking: FP2207Rx (x = Version indicator), Rxxx = Inductance value in uH, R= decimal point), xxxx=Lot code

Tolerances are ±0.15 unless stated otherwise

Pad layout tolerances are ±0.1 unless stated otherwise

Soldering surfaces to be coplanar within 0.1 millimeters

DCR measured from point “a” to point “b”

Hipot measured from point “c” to point “d”

Secure Inductor to PCB using Circuit Bond LV (or equivalent) adhesive for mechanical stability to meet Vibration, Mechanical shock and shear

force requirements.

Do not route traces or vias underneath the inductor

typ

typ

c

d