Fully automatic dual spindle dicing saw

with two chuck tables to improve productivity



The DFD6760 is a high end model which has further enhanced productivity

from the DFD6362 fully automatic dicing saw for ø300 mm

wafers. It has seen wide industry acceptance since its launch in 2008.

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Since this dicing saw has two chuck tables, it is possible for transfer and

alignment to occur on one chuck table, while processing is performed on

the other chuck table. This shortens the spindle waiting time for

processing considerably and improves productivity.

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Since the DFD6760 has two chuck tables, inspection and measurement

operations including workpiece image recording and workpiece thickness

measurement using an NSD* can be performed on one chuck table, while

processing proceeds on the other chuck table to maintain throughput. of

the workpiece after processing can be recorded or workpiece



Increased X, Y and Z-axis feed speed (same as the DFD6362) also

contributes towards reduced processing time.

*Non-contact surface height detector (option)

DFD6760

High end dicing saw for ø300 mm wafers

Fully Automatic Dicing Saw

Enhancing the quality of thin wafer processing

while maintaining throughput

For thin wafer step cuts, controlling the cut depth from the wafer surface is

important. The NSD that is used to control the cut depth makes it possible to

measure the wafer upper surface height very accurately. Typically, the NSD

requires about 10 seconds to make the measurements, but in the case of the

DFD6760, the NSD makes the measurements while processing the wafer on

the other chuck table, so the throughput does not deteriorate.

Various measures to prevent particles

The cut section atomizing nozzle, wheel cover, and chuck table water curtain,

which have been well received in the DFD6362, are selectable as optional

accessories in accordance with workpiece characteristics.

DFD6760 operation flow

Process flow comparison with existing model