Enhanced dicing throughput

The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual

design and a reduction in distance between the blades help to control total cut

time, while high-magnification microscopes (standard) and non-contact setup

sensors (option) for both Z1 and Z2 reduce the time required for non-dicing

sequences, such as kerf check and blade setup.

Consistent cut quality

DFD6361 offers highly consistent and dependable cut quality through the new

cleaning mechanism can also be installed in the spinner unit as an option to

effectively clean wafers after dicing (Patent no.3410385).

DFD6361

Advanced performance for 300 mm dicing

Fully Automatic Dicing Saw

Improved usability



The spindle shaft-lock feature and auto-open/close wheel cover

make blade changes easy and quick.



Condition monitoring functions relay processing status and key

equipment information in real time.



The cutting water flow rate controller is programmable via the

touch-panel display and sets the flow rate for each process recipe.



The easy-to-use graphical user interface is displayed on an

adjustable touch-panel display.

Adjustable LCD

Control screen

Condition monitor screen

LCD touch screen

Small footprint

The bridge-type frame structure and improved wafer handling

system contribute to the compact size and small footprint of the

DFD6361.

Spindle lineup



The 1.2 kW spindle (standard) features superior rigidity.



A center thrust design gives the 1.8 kW spindle (option,

uses 2 ” blades) and the 2.2 kW spindle (option, uses 3 ”

blades) extra rigidity for processing glass, ceramics, and

other high processing load materials.