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MA6002 датащи(PDF) 8 Page - Major-Power Technology Co., LTD.

номер детали MA6002
подробное описание детали  Dual 1.2A 1.5MHz Synchronous Buck Converter
PDF  9 Pages
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производитель  MPOWER [Major-Power Technology Co., LTD.]
домашняя страница  http://major-power.com.tw/
Logo MPOWER - Major-Power Technology Co., LTD.

MA6002 датащи(HTML) 8 Page - Major-Power Technology Co., LTD.

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MA6002
Major Power Technology Co., Ltd.
Rev.1.1
Aug.28, 2015
junction temperature of the die and TA is the ambient temperature. The junction to ambient
thermal resistance
θJA is layout dependent. For TDFN-10L (3x3) packages, the thermal
resistance
θJA is 60°C/W on the 1 in2 Multi-layer PCB copper area (The IC exposed pad
must be connected to the PCB Copper area) two-layers thermal test board. The maximum
power dissipation at TA = 25°C can be calculated by following formula:
PD(MAX) = (125°C - 25°C) / (45°C/W) = 2.2W for TDFN-10L (3x3) package
The maximum power dissipation depends on operating ambient temperature for fixed
TJ(MAX) and thermal resistance
θJA.
Layout Guide
1. Input Capacitors (C1, C2) are necessarily closed to IC.
2. Feedback low-side resistor’s (R2, R4) ground trace close to input capacitor’s ground trace.
3. All power trace is wide and short.
4. Feedback trace must keep inductor’s trace away
C1
L2
C4
C5
EN1
FB2
110
2
3
47
8
9
FB1
VIN2
GND2
VIN1
GND1
SW1
Exposed
Pad
56
EN2
SW2
C2
R2
R1
C3
R3
R4
L2
C6
Via to VIN1
Via to VIN2
VOUT1
VOUT2
GND



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