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Rev. A.2 - July., 2004
HPW7095/A
21
Copyright HIPAC Semiconductor, Inc.
www.hipacsemi.com
t 25 C to Peak
tp
Ram p-up
t
L
Ram p-down
ts
Preheat
Tsm ax
Tsm in
T
L
T
P
25
Tim e
Critical Zone
T
L to T P
°
Physical Specifications
Reflow Condition (IR/Convection or VPR Reflow)
Classificatin Reflow Profiles
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Profile Feature
Large Body
Small Body
Large Body
Small Body
Average ramp-up rate
(TL to TP)
3
°C/second max.
3
°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
100
°C
150
°C
60-120 seconds
150
°C
200
°C
60-180 seconds
Tsmax to TL
- Ramp-up Rate
3
°C/second max
Tsmax to TL
- Temperature(T
L)
- Time (t
L)
183
°C
60-150 seconds
217
°C
60-150 seconds
Peak Temperature(Tp)
225 +0/-5
°C
240 +0/-5
°C
245 +0/-5
°C
250 +0/-5
°C
Time within 5
°C of actual Peak
Temperature(tp)
10-30 seconds
10-30 seconds
10-30 seconds
20-40 seconds
Ramp-down Rate
6
°C/second max.
6
°C/second max.
Time 25
°C to Peak Temperature
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Terminal Material
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Lead Solderability
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
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