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AL5809 датащи(PDF) 8 Page - Diodes Incorporated

номер детали AL5809
подробное описание детали  60V Two Terminal Constant Current LED Driver
PDF  16 Pages
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производитель  DIODES [Diodes Incorporated]
домашняя страница  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AL5809 датащи(HTML) 8 Page - Diodes Incorporated

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AL5809
Document number: DS36625 Rev. 5 - 2
8 of 16
www.diodes.com
December 2016
© Diodes Incorporated
AL5809
Application Information (cont.)
Power Dissipation
The maximum ambient temperature range of the AL5809 is determined by its power dissipation and thermal impedance of the PCB onto which it
is mounted. Its junction temperature must be kept equal to or less than +125°C.
The power dissipated is determined by the LED current version that has been selected (15, 20, 25 30, 40, 50, 60, 90, 100, 120 or 150mA) and
the difference between the input voltage and LED chain voltage.
VINOUT * ILED
In a typical 12V system, the input voltage can vary between 11.4V and 12.6V. The recommended minimum VINOUT voltage of 2.5V enables the
AL5809 to drive 2 LED in series from the 12V rail (assuming VLED <3.25V).
The AL5809’s power dissipation under minimum input voltage conditions will be:
VINOUT * ILED = (11.4-6.5) * ILED
So for the 20mA AL5809-20PI under these conditions this equals:
4.9V * 20mA = 98mW
Under maximum input conditions (12.6V) the AL5809’s power dissipation will be:
VINOUT * ILED = (12.6-6.5) * ILED
So for the 20mA AL5809-20QPI this equals:
6.1V * 20mA = 122mW
So there is a large difference in power dissipation of the Linear LED driver between minimum and maximum battery voltages. And care must be
taken to calculate expected power dissipations and then determine the suitable PCB material and layout. See Figures 9, 10 and 11 for graphs
showing power dissipation and maximum VINOUT, for different currents and PCB material. Maximizing the area and mass of the ground plane and
additional vias between the pad of the OUT pin will improve the thermal impedance (JA) of the AL5809.
0.00
0.25
0.50
0.75
1.00
1.25
1.50
0
25
50
75
100
125
Ambient Temperature (°C)
Power Dissipation [W] vs. Ambient Temperature [⁰C]
for
PDI-123,SOD-123 on FR4, and PDI-123 on Getek
SOD on FR4 (
max Tj=145)
PDI on Getek (
max Tj=145)
PDI on FR4 (
max Tj=145)
Figure 9 Power Dissipation vs. Ambient Temperature
@TJ = +145°C
0
10
20
30
40
50
60
0
25
50
75
100
125
150
Ambient Temperature [°C]
Maximum VInOut [V] vs. Ambient Temperature [
⁰C]forPDIonFR4
Current Options (referred by Apps board FR4, 2-layer, 0.69"x0.76")
PDI on FR4 15mA
PDI on FR4 20mA
PDI on FR4 25mA
PDI on FR4 50mA
PDI on FR4 90mA
PDI on FR4 150mA
PDI on FR4 40mA
PDI on FR4 60mA
Figure 10 Maximum VInOut vs. Temperature
0
5
10
15
20
25
30
35
40
0
25
50
75
100
125
Ambient Temperature [°C]
Maximum VInOut [V] vs. Ambient Temperature [
⁰C]forCurrentOptiononPDI
FR4 Board (referred by Apps board FR4, 2-layer, 0.69"x0.76" size)
SOD on FR4 15mA
SOD on FR4 20mA
SOD on FR4 30mA
SOD on FR4 40mA
SOD on FR4 50mA
Figure 11 Maximum VInOut vs. Temperature



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