ZXMN3B14F

SEMICO NDUC TORS

ISSUE 1 - JUNE 2005

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient

(a)

125

°C/W

Junction to Ambient

(b)

83

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(b) For a device surface mounted on FR4 PCB measured at t

5 sec.

(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300 s - pulse width limited by maximum junction temperature.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

30

V

Gate-Source Voltage

12

V

(b)

(b)

(a)

3.5

2.9

2.9

A

A

A

Pulsed Drain Current

(c)

16

A

Continuous Source Current (Body Diode)

(b)

2.4

A

Pulsed Source Current (Body Diode)

(c)

16

A

(a)

Linear Derating Factor

1

8

W

mW/°C

(b)

Linear Derating Factor

1.5

12

W

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS