UG54GS

Taiwan Semiconductor

2

Version:A1702

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction-to-lead thermal resistance

14

°C/W

Junction-to-ambient thermal resistance

60

°C/W

Junction-to-case thermal resistance

16

°C/W

Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage per diode

(1)

0.83

1.05

V

0.89

1.10

V

0.69

0.95

V

0.76

1.00

V

(2)

-

10

µA

-

100

µA

Junction capacitance

45

-

pF

Reverse recovery time

-

20

ns

Notes:

1. Pulse test with PW=0.3 ms

2. Pulse test with PW=30 ms

ORDERING INFORMATION

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

PACKAGE

PACKING

UG54GS

(Note 1)

H

A0

G

DO-15

1,500 / Ammo box

R0

DO-15

3,500 / 13" Paper reel

B0

DO-15

1,000 / Bulk packing

Note:

1. Whole series with green compound (halogen-free)

EXAMPLE

EXAMPLE P/N

PART NO.

PART NO.

SUFFIX

PACKING

CODE

PACKING CODE

SUFFIX

DESCRIPTION

UG54GSHA0G

UG54GS

H

A0

G

AEC-Q101 qualified

Green compound