AP63200/AP63201/AP63203/AP63205

Layout

PCB Layout

1.

The AP63200/AP63201/AP63203/AP63205 device works at 2A current load, so heat dissipation is a major concern in the layout of the PCB.

2oz copper for both the top and bottom layers is recommended.

2.

Provide sufficient vias for the input and output capacitors’ GND side to dissipate heat to the bottom layer.

3.

Make the bottom layer under the device as the GND layer for heat dissipation. The GND layer should be as large as possible to provide

better thermal effect.

4.

Place the VIN capacitors as close to the device as possible.

5.

Place the feedback components as close to FB as possible.

6.

See Figure 25 for reference.

C1

C2

L1

C3

R2

VIN

VOUT

SW

1

2

3

4

5

6

FB

EN

VIN

GND

SW

BST

GND

Figure 25. Recommended Layout

AP63200/AP63201/AP63203/AP63205

Document number: DS41326 Rev. 2 - 2

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January 2019

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