uP1537

13

uP1537-DS-F0000, Feb. 2018

www.upi-semi.com

Package Information

WDFN3X3 - 10L

Note

1.Package Outline Unit Description:

BSC: Basic. Represents theoretical exact dimension or dimension target

MIN: Minimum dimension specified.

MAX: Maximum dimension specified.

REF: Reference. Represents dimension for reference use only. This value is not a device specification.

TYP. Typical. Provided as a general value. This value is not a device specification.

2.Dimensions in Millimeters.

3.Drawing not to scale.

4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

1

5

6

10

Recommended Solder Pitch and Dimensions

0.18 - 0.30

0.50 BSC

2.90 - 3.10

0.30 - 0.50

2.20 - 2.70

0.00 - 0.05

0.20 REF

2.20 - 2.70

0.18 - 0.30

0.50 BSC

0.70 - 0.80