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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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02016D107MAT2A датащи(PDF) 2 Page - AVX Corporation |
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02016D107MAT2A датащи(HTML) 2 Page - AVX Corporation |
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2 / 4 page  X5R Dielectric Specifications and Test Methods 042418 27 27 Parameter/Test X5R Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +85ºC Temperature Cycle Chamber Capacitance Within specified tolerance Freq.: 1.0 kHz ± 10% Voltage: 1.0Vrms ± .2V For Cap > 10 µF, 0.5Vrms @ 120Hz Dissipation Factor ≤ 2.5% for ≥ 50V DC rating ≤ 12.5% for 25V, 35V DC rating ≤ 12.5% Max. for 16V DC rating and lower Contact Factory for DF by PN Insulation Resistance 10,000MΩ or 500MΩ - µF, whichever is less Charge device with rated voltage for 120 ± 5 secs @ room temp/humidity Dielectric Strength No breakdown or visual defects Charge device with 250% of rated voltage for 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Resistance to Flexure Stresses Appearance No defects Deflection: 2mm Test Time: 30 seconds Capacitance Variation ≤ ±12% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance ≥ Initial Value x 0.3 Solderability ≥ 95% of each terminal should be covered with fresh solder Dip device in eutectic solder at 230 ± 5ºC for 5.0 ± 0.5 seconds Resistance to Solder Heat Appearance No defects, <25% leaching of either end terminal Dip device in eutectic solder at 260ºC for 60sec- onds. Store at room temperature for 24 ± 2hours before measuring electrical properties. Capacitance Variation ≤ ±7.5% Dissipation Factor Meets Initial Values (As Above) Insulation Resistance Meets Initial Values (As Above) Dielectric Strength Meets Initial Values (As Above) Thermal Shock Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±7.5% Step 2: Room Temp ≤ 3 minutes Dissipation Factor Meets Initial Values (As Above) Step 3: +85ºC ± 2º 30 ± 3 minutes Insulation Resistance Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes Dielectric Strength Meets Initial Values (As Above) Repeat for 5 cycles and measure after 24 ± 2 hours at room temperature Load Life Appearance No visual defects Charge device with 1.5X rated voltage in test chamber set at 85ºC ± 2ºC for 1000 hours (+48, -0). Note: Contact factory for *optional specification part numbers that are tested at < 1.5X rated voltage. Remove from test chamber and stabilize at room temperature for 24 ± 2 hours Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) Load Humidity Appearance No visual defects Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. Remove from chamber and stabilize at room temperature and humidity for 24 ± 2 hours before measuring. Capacitance Variation ≤ ±12.5% Dissipation Factor ≤ Initial Value x 2.0 (See Above) Insulation Resistance ≥ Initial Value x 0.3 (See Above) Dielectric Strength Meets Initial Values (As Above) 100917 5 C0G (NP0) Dielectric Specifications and Test Methods Parameter/Test NP0 Specification Limits Measuring Conditions Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber Capacitance Within specified tolerance Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF Q <30 pF: Q≥ 400+20 x Cap Value 1.0 kHz ± 10% for cap > 1000 pF ≥30 pF: Q≥ 1000 Voltage: 1.0Vrms ± .2V Insulation Resistance 100,000MΩ or 1000MΩ - µF, Charge device with rated voltage for whichever is less 60 ± 5 secs @ room temp/humidity Charge device with 250% of rated voltage for Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current limited to 50 mA (max) Note: Charge device with 150% of rated voltage for 500V devices. Appearance No defects Deflection: 2mm Capacitance Test Time: 30 seconds Resistance to Variation ±5% or ±.5 pF, whichever is greater Flexure Q Meets Initial Values (As Above) Stresses Insulation ≥ Initial Value x 0.3 Resistance Solderability ≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC with fresh solder for 5.0 ± 0.5 seconds Appearance No defects, <25% leaching of either end terminal Capacitance Variation ≤ ±2.5% or ±.25 pF, whichever is greater Dip device in eutectic solder at 260ºC for 60 Q Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2 Resistance to hours before measuring electrical properties. Solder Heat Insulation Meets Initial Values (As Above) Resistance Dielectric Meets Initial Values (As Above) Strength Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes Capacitance Variation ≤ ±2.5% or ±.25 pF, whichever is greater Step 2: Room Temp ≤ 3 minutes Q Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes Thermal Shock Insulation Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes Resistance Dielectric Meets Initial Values (As Above) Repeat for 5 cycles and measure after Strength 24 hours at room temperature Appearance No visual defects Capacitance Variation ≤ ±3.0% or ± .3 pF, whichever is greater Charge device with twice rated voltage in ≥ 30 pF: Q≥ 350 test chamber set at 125ºC ± 2ºC Load Life Q ≥10 pF, <30 pF: Q≥ 275 +5C/2 for 1000 hours (+48, -0). (C=Nominal Cap) <10 pF: Q≥ 200 +10C Insulation ≥ Initial Value x 0.3 (See Above) Remove from test chamber and stabilize at Resistance room temperature for 24 hours Dielectric Meets Initial Values (As Above) before measuring. Strength Appearance No visual defects Capacitance Variation ≤ ±5.0% or ± .5 pF, whichever is greater Store in a test chamber set at 85ºC ± 2ºC/ ≥ 30 pF: Q≥ 350 85% ± 5% relative humidity for 1000 hours Load Q ≥10 pF, <30 pF: Q≥ 275 +5C/2 (+48, -0) with rated voltage applied. Humidity <10 pF: Q≥ 200 +10C Insulation ≥ Initial Value x 0.3 (See Above) Remove from chamber and stabilize at Resistance room temperature for 24 ± 2 hours Dielectric Meets Initial Values (As Above) before measuring. Strength |
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