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LP5907-Q1

SNVSA34D – SEPTEMBER 2014 – REVISED DECEMBER 2018

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Copyright © 2014–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the GND pin.

(3)

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

Output voltage

–0.3

V

Enable input voltage

–0.3

6

V

Internally limited

W

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC

All pins

±2000

V

Charged-device model (CDM), per AEC

Q100-011

Corner pins (1,3,4,5)

±1000

Other pin (2)

±1000

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the GND pin.

(3)

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input supply voltage

2.2

5.5

V

Enable input voltage

0

5.5

V

Output current

0

250

mA

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

LP5907-Q1

UNIT

DBV (SOT-23)

DQN (X2SON-4)

5 PINS

4-PINS

Junction-to-ambient thermal resistance

186.9

198.4

°C/W

Junction-to-case (top) thermal resistance

112.3

109.3

°C/W

Junction-to-board thermal resistance

52.3

128.3

°C/W

Junction-to-top characterization parameter

27.5

2.6

°C/W

Junction-to-board characterization parameter

51.8

128.3

°C/W