NICHIA STS-DA1-4024G <Cat.No.180911>

5

SOLDERING

• Reflow Soldering Condition(Lead-free Solder)

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec

● Recommended Soldering Pad Pattern

● Recommended Metal Solder Stencil Aperture

(単位 Unit: mm)

0.3

1.15

R0.075

0.4

1.05

R0.075

* This LED is designed to be reflow soldered to a PCB. If dip soldered or hand soldered, Nichia will not guarantee its reliability.

* Reflow soldering must not be performed more than twice.

* The reflow profile should be determined based on the recommended soldering conditions for the solder paste that is used.

* When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly.

* During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. In particular,

reflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristics than if a

nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.