NICHIA STS-DA1-3955D <Cat.No.181017>

6

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec

• Recommended Hand Soldering Condition

Temperature

350°C Max

Soldering Time

3sec Max

● Recommended Soldering Pad Pattern

(単位 Unit: mm)

0.5

3.6

* This LED is designed to be reflow soldered to a PCB. If dip soldered, Nichia will not guarantee its reliability.

* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.

* When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly.

* During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. In particular,

reflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristics than if a

nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.

* This LED uses a silicone resin for the encapsulating resin; the silicone resin is soft. If pressure is applied to the silicone resin, it

may cause the resin to be damaged, chipped, delaminated and/or deformed. If the resin is damaged, chipped, delaminated

and/or deformed, it may cause the wire to break causing a catastrophic failure (i.e. the LED not to illuminate) and/or reliability

issues (e.g. the LED to corrode and/or to become dimmer, the color/directivity to change, etc.). Ensure that pressure is not

applied to the encapsulating resin.

* Once the LEDs have been soldered to a PCB, it should not be repaired/reworked. If it must be done, using a double-head soldering

iron is strongly recommended. Ensure that sufficient verification is performed prior to use to ensure that the repair/rework has

not caused the LED characteristics to deteriorate.

* When soldering, do not apply stress to the LED while the LED is hot.

* When using an automatic pick-and-place machine, choose an appropriate nozzle for this LED. Using a pick-and-place nozzle with

a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface causing a catastrophic

failure (i.e. the LED not to illuminate).

* The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precision

is required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized.

* Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the

flux will come in contact with the LEDs.

* Ensure that there are no issues with the type and amount of solder that is being used.