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AD5693R/AD5692R/AD5691R/AD5693

Data Sheet

Rev. D | Page 24 of 26

RECOMMENDED REGULATOR

The AD5693R/AD5692R/AD5691R/AD5693 use a 5 V (VDD)

supply as well as a digital logic supply (VLOGIC).

The analog and digital supplies required for the AD5693R/

AD5692R/AD5691R/AD5693 can be generated using Analog

Devices, Inc., low dropout (LDO) regulators such as the ADP7118

and the ADP162, respectively, for analog and digital supplies.

LAYOUT GUIDELINES

In any circuit where accuracy is important, careful consideration of

the power supply and ground return layout helps to ensure the

rated performance. Design the printed circuit board (PCB) on

which the ADCs are mounted such that the AD5693R/AD5692R/

AD5691R/AD5693 lie on the analog plane.

Ensure that the AD5693R/AD5692R/AD5691R/AD5693 have

ample supply bypassing of 10 µF, in parallel with a 0.1 µF capacitor

on each supply that is located as near the package as possible

(ideally, right up against the device). The 10 µF capacitors are

of the tantalum bead type. Ensure that the 0.1 µF capacitor has

low effective series resistance (ESR) and low effective series

inductance (ESI), such as the common ceramic types, which

provide a low impedance path to ground at high frequencies to

handle transient currents due to internal logic switching.

In systems where many devices are on one board, it is often

useful to provide some heat sinking capability to allow

the power to dissipate easily.

The LFCSP package of the AD5693R/AD5692R/AD5691R/

AD5693 has an exposed pad beneath the device. Connect this

pad to the GND supply of the device. For optimum performance,

use special consideration when designing the motherboard and

mounting the package. For enhanced thermal, electrical, and

board level performance, solder the exposed pad on the bottom

of the package to the corresponding thermal land pad on the

PCB. Design thermal vias into the PCB land pad area to further

improve heat dissipation.

The GND plane on the device can be increased (as shown in

Figure 51) to provide a natural heat sinking effect.

AD5693R/

AD5692R/

AD5691R/

AD5693

GND

PLANE

BOARD

Figure 51. Pad Connection to Board

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