4

IXA531

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage

parameters are absolute voltages referenced to LS. The thermal resistance and power dissipation ratings are

measured under board mounted and still air conditions

Symbol

Definition

Min.

Max.

Units

VCH1,2,3

High side floating supply voltage

VHS1,2,3 + 12

VHS1,2,3 + 35

V

VHS1,2,3

High side floating supply offset voltage

- 200

650

V

VHGO1,2,3 High side floating output voltage

VHS1,2,3

VCH1,2,3

V

VLGO1,2,3

Low side output voltage

0

VCL

V

VCL

Low side and logic fixed supply voltage

12

35

V

VDG

Logic Supply offset voltage

VLS - 0.3

VLS + 0.3

V

VFLT

FAULT output voltage

VDG

VCL

V

VRST

RST input voltage

VDG

VCL

V

VITRP

ITRP input voltage

VDG

VCL

V

_______ _______

VIN

Logic input voltage HIN1,2,3, LIN1,2,3, EN

VDG or VLS

VCL

V

TA

Ambient temperature

-40

125

O

C

Recommended Operating Conditions

For proper operation the device should be used within the recommended conditions. All voltage parameters are absolute

Symbol Definition

Min.

Max.

Units

VCH

High side floating supply voltage , (VCH1,2,3)

-200

650

V

VHS

High side floating supply offset voltage , (VHS1,2,3)VCH1,2,3 - 35

VCH1,2,3 + 0.3

V

VHGO

High side floating output voltage , (VHGO1,2,3)VHS1,2,3– 0.3

VCH1,2,3 + 0.3

V

VCL

Low side and logic fixed supply voltage

8.0

35

V

VDG

Logic Supply offset voltage

VLS - 0.7

VLS + 0.7

V

VLGO

Low side output voltage

- 0.3

VCL + 0.3

V

_______ _______

Lower of

VIN

Input voltage HIN1,2,3, LIN1,2,3, ITRP, RST , EN

VDG – 0.3

(VDG + 35) or

V

(VCL + 0.3)

VFLT

FAULT output voltage

VDG – 0.3

VCL + 0.3

V

dV/dt

50

V/ns

PD

2.0

W

RthJA

Thermal resistance, junction to ambient

63

K/W

TJ

Junction temperature

125

TS

Storage temperature

-55

150

TL

Lead temperature (soldering, 10 seconds)

300