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BGA150FR

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications

www.bencent.com.cn

Order Code:

BGA150FR

GDT Array

Version: A1 2016-8-12

B

GA

150

FR

(1)

(2)

(3)

(4)

(1)

Bencent

(2)

GA

means

GDT Array

(3)

(4)

FR

：Four means that four gas discharge tubes

Integrate to one GDT Array.

Part Numbering System

Recommended Soldering Pad

Environmental Reliability Characteristics

Lead Material

Tungsten/copper

Body Material

Ceramics

Terminal Finish

Tin Plated

Product Characteristics

Testing items

Technical standards

High Temperature Storage Test

Temperature: 90℃

Time:2H

Low Temperature Storage Test

Temperature: -40℃

Time:2H

Vibration

Frequency：10-500Hz

Amplitude：0.15mm

Time：45min

Resistance of soldering heat

Temperature: 260±5℃

Time of dip soldering：10s，1time

REF

mm

inch

A

1.3

0.051

B

1.2±0.2

C

1.8

0.071

D

1.2±0.2

E

5.8±0.3

F

7.0±0.3

G

0.3±0.2

H

1.5±0.2

REF

mm

inch

A

1.5

0.059

B

2.4

0.094

C

6

0.236

D

6.5

0.256

E

1.1

0.043

F

6.6

0.260

Note: Up-screen program can be specified by customer’s request via contacting Bencent service

Solderability test

Solderability

Solder Pot Temperature:

245℃±5℃

Solder Dwell Time:

4-6 seconds

Product Dimensions

1

2

3

6

5

4

A

C

C

E

F

A

A

D

B

B

C

B

B

A

A

A

D

F

E

G

H