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2

*1 Refer to MOS FET A.S.O curve

*2 MOS FET Tch-EAS curve

*3 Refer to MOS FET Ta-PD1 curve

*4 Refer to TF-PD2 curve for Control IC (See page 5)

*5 Maximum switching current. The maximum switching current is the Drain current determined by the drive

voltage of the IC and threshold voltage (Vth) of MOS FET. Therefore, in the event that voltage drop

occurs between Pin 1and Pin 2 due to patterning, the maximum switching current decreases as shown by

V

curve of the maximum switching current.

*6 When embedding this hybrid IC onto the printed circuit board (board size 15mm×15mm)

Absolute Maximum Ratings (Ta=25℃

℃

℃

℃

) (Refer Gnd 2 and 5)

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are

absolute voltages referenced to terminals stated, all currents are defined positive into any lead. The thermal resistance and power

dissipation ratings are measured under board mounted and still air conditions.

IRIS-A6331

Symbol

Definition

Terminals Max. Ratings

Units

Note

Drain Current

*1

8

3.54

A

Single Pulse

Ta=-20~+125℃

Single Pulse

Vin

Input voltage for control part

3-2

35

V

Vth

O.C.P/F.B Pin voltage

4-2

6

V

Power dissipation for MOSFET *3

8-1

1.35

W

*6

Power dissipation for control part

(Control IC) *4

Internal frame temperature

Refer to recommended

in operation

operating temperature

Top

Operating ambient temperature

-

-20 ~ +125

℃

Tstg

Storage temperature

-

-40 ~ +125

℃

Tch

Channel temperature

-

150

℃

A

Single pulse avalanche energy *2

8-1

32

mJ

Maximum switching current *5

8

3.54

Specified by

Vin×Iin

-

-20 ~ +125

℃

3-2

0.14

W

Fig.1