CPC7524

R02

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15

4.5 Mechanical Dimensions

4.5.1 Package Dimensions

4.5.2 Tape & Reel Specification

(inches)

mm

DIMENSIONS

NOTES:

1. Coplanarity = 0.1016 (0.004) max.

2. Leadframe thickness does not include solder plating (1000 microinch maximum).

0.254 / +0.051 / -0.025

(0.010 / +0.002 / -0.001)

0.889 ± 0.178

(0.035 ± 0.007)

45º

0.406 ± 0.076

(0.016 ± 0.003)

17.932 ± 0.254

(0.706 ± 0.010)

1.270 TYP

(0.050 TYP)

PIN 1

PIN 28

0.649 ± 0.102

(0.026 ± 0.004)

2.337 ± 0.051

(0.092 ± 0.002)

0.203 ± 0.102

(0.008 ± 0.004)

2.00

(0.079)

1.27

(0.050)

9.40

(0.370)

0.60

(0.024)

Recommended PCB Land Pattern

Dimensions

mm

(inches)

Top Cover

Tape Thickness

0.102 MAX

(0.004 MAX)

330.2 DIA.

(13.00 DIA)

Embossed Carrier

Embossment

A

(0.429)

B

(0.720)

W=24.00+0.03/-0.01

(0.945+0.001/-0.0004)

K

(0.106)

K

(0.126)

P=12.00

(0.472)

Notes:

1. Unless otherwise specified, all dimensional tolerances per EIA standard 481

2. Unless otherwise specified, all dimensions ±0.10 (0.004)

Specifications: DS-CPC7524-R02

© Copyright 2017, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

2/28/2017

For additional information please visit www.ixysic.com

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