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CPC1466D датащи(PDF) 13 Page - IXYS Corporation |
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CPC1466D датащи(HTML) 13 Page - IXYS Corporation |
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13 / 14 page ![]() INTEGRATED CIRCUITS DIVISION R03 www.ixysic.com 13 CPC1466 3.5 Mechanical Dimensions 3.5.1 CPC1466M 16-Pin DFN Package 3.5.2 CPC1466MTR 16-Pin DFN Tape & Reel EXPOSED METALLIC PAD 7.00 ± 0.25 (0.276 ± 0.01) 6.00 ± 0.25 (0.236 ± 0.01) INDEX AREA TOP VIEW SEATING PLANE SIDE VIEW 0.90 ± 0.10 (0.035 ± 0.004) 0.30 ± 0.05 (0.012 ± 0.002) 0.02, + 0.03, - 0.02 (0.0008, + 0.0012, - 0.0008) 0.20 (0.008) 4.25 ± 0.05 (0.167 ± 0.002) 0.55 ± 0.10 (0.022 ± 0.004) 6.00 ± 0.05 (0.236 ± 0.002) BOTTOM VIEW Dimensions mm (inch) Terminal Tip Pin 16 Pin 1 0.80 (0.032) DIMENSIONS mm (inches) 5.80 (0.228) 0.35 (0.014) 1.05 (0.041) 0.80 (0.031) Recommended PCB Land Pattern NOTE: Because the metallic pad on the bottom of the DFN package is connected to the substrate of the die, it is recommended that no printed circuit board traces or vias be placed under this area. K 0=1.61 ± 0.10 (0.063 ± 0.004) A 0=6.24 ± 0.10 (0.246 ± 0.004) B 0=7.24 ± 0.10 (0.285 ± 0.004) P1=12.00 ± 0.10 (0.472 ± 0.004) W=16.00 ± 0.30 (0.630 ± 0.012) Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) DIMENSIONS mm (inches) Direction of feed |
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