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4

R06

CPC1301

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to

the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product

evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device

Moisture Sensitivity Level (MSL) Rating

CPC1301G

MSL 1

CPC1301GR

MSL 3

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the Classification Temperature (T

body temperature of this device may be above (T

Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1301GR, the solder

reflow profile given in Technical Brief TB-200 "Pb-Free Solder Reflow Profile for Select Devices" must be followed.

For the through-hole device, CPC1301G, and any other processes, the guidelines of J-STD-020 must be observed.

Device

Maximum Body Temperature (T

Time

CPC1301GR

250ºC

15 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce

or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken

to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash

and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the

washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake

temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the

user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not

be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.