AD9552 datasheet(19/32 Pages) AD

19 / 32 page

Data Sheet

AD9552

Rev. E | Page 19 of 32

APPLICATIONS INFORMATION

THERMAL PERFORMANCE

Table 13. Thermal Parameters for the 32-Lead LFCSP Package

Symbol

Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board

Value

Unit

Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)

40.5

°C/W

JMA

Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)

35.4

°C/W

JMA

Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)

31.8

°C/W

Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)

23.3

°C/W

Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1

4.2

°C/W

Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)

0.4

°C/W

1 The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.

2 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the

application to determine whether they are similar to those assumed in these calculations.

The AD9552 is specified for an ambient temperature (T

A). To

ensure that T

A is not exceeded, an airflow source can be used.

Use the following equation to determine the junction tempera-

ture on the application PCB:

J = TCASE + (ΨJT × PD)

where:

J is the junction temperature (°C).

CASE is the case temperature (°C) measured by the customer

at the top center of the package.

JT is the value indicated in Table 13.

D is the power dissipation (see the Specifications section).

Values of θ

JA are provided for package comparison and PCB design

considerations. θ

JA can be used for a first-order approximation

of T

J using the following equation:

J = TA + (θJA × PD)

where T

A is the ambient temperature (°C).

Values of θ

JC are provided for package comparison and PCB

design considerations when an external heat sink is required.

Values of θ

JB are provided for package comparison and PCB

design considerations.

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