Figure 1. Pin Connections

(Top View)

18

27

36

N.C.

4

5

N.C.

Power Down

N.C.

GND

N.C.

Note: Exposed backside of the package is

DC and RF ground.

2

RF Device Data

Freescale Semiconductor, Inc.

MML09231HT1

Characteristic

Symbol

Min

Typ

Max

Unit

Small--Signal Gain (S21)

15.8

17.2

—

dB

Input Return Loss (S11)

IRL

—

--15

—

dB

Output Return Loss (S22)

ORL

—

--15

—

dB

Power Output @ 1dB Compression

P1dB

—

24.5

—

dBm

Third Order Input Intercept Point

IIP3

—

20.2

—

dBm

Third Order Output Intercept Point

OIP3

—

37.4

—

dBm

Reverse Isolation (S12)

|S12|

—

--21

—

dB

NF

—

0.36

—

dB

40

55

70

mA

Supply Voltage

—

5

—

V

Supply Current in Power Down Mode

—

1.1

—

mA

Input High Voltage

Input Low Voltage

2.2

0

—

—

0.5

V

1. Noise figure value calculated with connector losses removed.

2. DC current measured with no RF signal applied.

3. Limits derived from device characterization.

Table 5. Functional Pin Description

Pin

Number

Pin Function

1

2

3

No Connection

4

No Connection

5

No Connection

6

No Connection

7

8

Power Down (active high)

Table 6. ESD Protection Characteristics

Test Methodology

Class

Human Body Model (per JESD 22--A114)

1B, passes 700 V

Machine Model (per EIA/JESD 22--A115)

A

Charge Device Model (per JESD 22--C101)

IV

Table 7. Moisture Sensitivity Level

Test Methodology

Rating

Package Peak Temperature

Unit

Per JESD22--A113, IPC/JEDEC J--STD--020

1

260

C